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Environmental Project no. 778, 2003

Survey on Lead Free Solder Systems

Results of a Danish R&D project on the environmental and technical impacts of substituting lead containing solders by lead free solder systems

Abstract
The report covers an overview of the results achieved within the national Danish Lead Free Soldering project. The project has had the aim of comparing electronics joining technologies based on lead free alloys with traditional SnPb-solders. The report describes the environmental aspects of introducing lead free solder systems in electronics manufacture compared with lead containing solder. It also contains a technical assessment of two promising lead free solder systems (Sn-4.0Ag-0.5Cu and Sn-3.5Ag). Experiments have been carried out on FR4 PCBs using both reflow soldering and wave soldering techniques.

Abstract in Danish

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