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Survey on Lead Free Solder Systems

List of Contents

1 Foreword
     
2 Background
2.1 Legislation
     
3 Lead free soldering
3.1 Test set up
3.2 Test plan
3.3 Contamination and SIR Tests
3.4 Inspection of lead-free PCBs using the Omron VT-WIN
3.5 Double reflow soldering
3.6 Combined reflow and wave soldering
3.7 Hand soldering
3.8 Production case
     
4 Health and environmental issues
     
5 Conclusion
5.1 Lead free printed circuit board assembly
5.2 Reliability of lead free solder joints
5.3 Environmental impact
     
6 References
     
7 Appendix 1: Pb-free production case 
7.1 Introduction
7.2 Case objectives
7.3 Case set-up
7.4 Test schedule
7.5 Screen printing
7.6 SMD placement
7.7 Reflow soldering
7.8 Through-hole component mounting
7.9 Wave soldering
7.10 Hand soldering set-up
7.11 Results and observations
7.12 Conclusion
7.13 Hints
7.14 Contact information:
     
8 The toxicology of metals
Lead (Pb)
Tin (Sn)
Silver (Ag)
Copper (Cu)
Summary - toxicology
     
9 The toxicology of fluxes
Rosins and modified rosins
Solvents
Waxes
Antioxidants
Activators
Summary - toxicology
     
10 Toxicological evaluation of solders and fluxes
Reflow soldering (Pastes)
62Sn36Pb2Ag and flux
96.5Sn3.5Ag and flux
95.5Sn4Ag0.5Cu and flux
Evaluation
Wave-soldering (Alloys)
63Sn37Pb Alloy and Flux
95.5Sn3.8Ag0.7Cu Alloy and Flux
Evaluation
Hand-soldering (Wires)
60Sn40Pb and Flux
96.5Sn3.5Ag and Flux
Evaluation
Summary of toxicology
Occupational considerations
Consumer considerations
Environmental considerations
Conclusion and recommendations


The project has been carried out with support from the Council concerning Recycling and Cleaner Technology. Please note that the publication does not signify that the contents of the reports necessarily reflects the views of the Danish EPA or of the Council

 

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