Environmental
and technical characteristics of conductive adhesives versus soldering
Contents
1. Introduction
2. Toxicological aspects of
electrically conductive adhesives as compared to tin-lead soldering systems
2.1 Toxicological
aspects in connection with joining technology
2.2 Conductive
adhesives
2.2.1 Polymers
2.2.2 Solvents
2.2.3 Conductive
materials
2.2.4 Cleaning
agents
2.2.5 Evaluation
of conductive adhesives
2.3 Tin/lead solder
2.3.1 Lead
2.3.2 Tin
2.3.3 Silver
2.3.4 Flux
2.3.5 Solder
paste
2.3.6 Cleaning agents
2.3.7 Evaluation
of tin/lead solders
2.4 Metals in the
environment
2.4.1 Silver
2.4.2 Lead
2.4.3 Tin
2.4.4 Evaluation
2.5 Evaluation
2.5.1 Working
environment considerations
2.5.2 Consumer
considerations
2.5.3 Environment
considerations
2.6 Conclusions and
recommendations
2.6.1 Other
alternatives
3. Test cases with
conductive adhesives
3.1 Case descriptions
3.2 Assessment of
the test cases
4. Silver
resource aspects of substituting tin/lead solders with electrically conductive adhesives
4.1 Production,
consumption and reserves
4.1.1 Production
of virgin silver
4.1.2 Consumption
of silver
4.1.3 Silver
Resources
4.1.4 Silver
scarcity
4.1.5 Prices for silver
4.1.6 Trend
analysis
4.1.7 Production
of virgin lead
4.1.8 Lead
consumption and resources
4.1.9 Scarcity of
lead
4.1.10 Production
of virgin tin
4.1.11 Tin
consumption and resources
4.1.12 Scarcity
of tin
4.2 Substitution
scenarios
4.2.1 Scenario
calculations
4.3 Discussion
5. Recycling analysis
5.1 Material
contents
5.2 Recycling
process
5.2.1 Collection
5.2.2 Dismantling
facility
5.2.3 Metal
recovery - recycling
5.3 Differences in
material value
5.4 Differences in
environmental load
6. Occupational health aspects of
adhesive and solder technology
6.1 Comparison
6.2 Recommendations
6.2.1 Principles for designing a production line with
minimal impact on occupational health
6.3 Handling
conductive adhesives safely
7. Life cycle assessment
of electrically conductive adhesive vs. traditional tin/lead solder
7.1 Goal and scope
definition
7.1.1 Products/Alternatives
7.1.2 Functional unit
7.1.3 Process
tree, data quality and limitation of the life cycles
7.1.4 Assessment method
7.1.5 Irregularities
and accidents
7.1.6 Capital
goods
7.1.7 Allocation
7.1.8 Critical
review
7.2 Results –
Resources
7.2.1 SMT
scenario
7.2.2 Danfoss
scenario
7.3 Results -
External environment
7.3.1 SMT-scenario (disposal scenario: HW)
7.3.2 Danfoss
scenario (HW)
7.3.3 SMT
scenario (TH)
7.3.4 Danfoss
scenario (TH)
7.4 Conclusion and
Recommendations
8. Test of electrical conductive
adhesives
8.1 Survey of
electrical conductive adhesives tested
8.2 Survey of test
substrates
8.3 Survey of the
mounted components
8.3.1 Passive
components on each substrate variant
8.3.2 Active
components on each substrate variants
8.4 Survey of the
samples (adhesive/substrate)
8.5 Survey of the
mounting process
8.5.1 Stencil
printing of adhesives/solder paste
8.5.2 Dispensing
of adhesives
8.6 Component
mounting
8.7 Curing/soldering
8.8 Cleaning
8.9 Test plan
8.10 Description
of the tests
8.10.1 Adhesion
test
8.11 Current -
temperature
8.12 Discussion
8.13 Comments to
each electrical conductive adhesive variant
9. Conclusion
10.
References
The project has been carried out with support from the Council concerning Recycling
and Cleaner Technology. Please note that the publication does not signify that the
contents of the reports necessarily reflects the views of the Danish EPA or of the Council
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